A primer for engineers on simulating thermal phenomena in 3D printing. Working chamber Laser sintering machine for metal. The process of creating a metal object with a laser. 3D printer printing metal ...
AMCM has integrated its EOSPRINT software with PanX to bring physics-based simulation directly into build preparation for ...
The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its presence in the system analysis and design market with the introduction of the Cadence ® Celsius ™ ...
Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
Cadence Design Systems, Inc. introduced Cadence Celsius Thermal Solver, an electrical-thermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures. Based ...
The electronics industry exists in a continuous state of evolution. The world’s biggest companies are either launching new products, or refining and improving existing ones. In keeping with consumer ...
Cost-effective in-rack systems enable testing of standard 30kW or 50kW NeuCool liquid-cooled racks without multi-million-dollar hardware investments Custom testing configurations available, including ...
It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...
Shanghai University researcher, Qijie Zhai, never cared for trends. When the steel industry rapidly expanded in the 1990s in China, the fashionable research topic was working out how to remove ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results