A technical paper titled “Characterizing semiconductor devices for all-electric aircraft” was published by researchers at University of Strathclyde (Glasgow) and Airbus UpNext. “Cryogenic propulsion ...

System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...

SAN JOSE, Calif. – Power Integrations in San Jose, Calif., is introducing the SCALE-iFlex LT NTC family of silicon carbide (SiC) insulated-gate bipolar transistor (IGBT) power devices for systems with ...

NUREMBERG, Germany--(BUSINESS WIRE)--PCIM 2023 – Power Integrations (NASDAQ: POWI), the leader in gate-driver technology for medium- and high-voltage inverter applications, today introduced the ...

Yole Group announced the release of two new complementary analyses: IGBT 2025, a Market & Technology Trends report, and Si IGBT Comparison 2025, providing the industry’s most comprehensive analysis of ...