GlobalFoundries TSMC silicon interposer deal creates first US-based supply of the critical AI chip component for TSMC's CoWoS packaging ecosystem, with GF's Malta, New York fab targeting production in ...

GlobalFoundries signs a five-year silicon interposer deal with TSMC, with volume production expected to ramp in the first ...

Fig 1. The Xilinx Virtex-7 2000T, at 6.8 billion transistors, is the largest FPGA around (a). It’s implemented using 2.5D Stacked Silicon Interconnect technology (b). Fig 2. Xilinx’s Stacked Silicon ...

The advanced packaging architecture designed for AI and high-performance computing (HPC) applications involves positioning memory in close proximity to AI processors, such as GPUs and AI ASICs, on a ...

Intel EMIB vs TSMC CoWoS: Google, Amazon, and Cisco have committed to Intel's EMIB-T advanced packaging for inference-class AI chips, creating the first workload-structured packaging duopoly in AI ...

The design and analysis of an SoC based on an interposer is not for the faint of heart today, but the industry is aware of the challenges and is attempting to solve them. Until that happens, however, ...

Imec has demonstrated the exceptional performance and flexibility of its 300mm RF silicon interposer platform. The platform enables seamless integration of RF-to-sub-THz CMOS and III/V chiplets on a ...